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HomeProductsPrinted Circuit Board Multi Layer Board with Lead Free HASL and Impedance Control

Multi Layer Board with Lead Free HASL and Impedance Control


Premium PCB Factory Delivering Multi Layer Board with ENIG Finish


As a Premium PCB Factory Delivering Multi Layer Board with ENIG Finish, we specialize in high-complexity rigid PCB manufacturing that meets the rigorous demands of global procurement professionals. Our facility provides an extensive range of material options, including FR-4, Hi-Tg, Halogen-free, and Metal core, supporting advanced designs up to 50 layers. With a maximum board size of 546.1 x 622.4 mm and thicknesses ranging from 0.3 to 5.0 mm, we ensure precise board flatness tolerance within 0.50%. Our technical edge lies in achieving a 0.15 mm minimum finished hole and high-density trace space of 2.5/2.5 mil on outer layers. From green solder mask applications to lead-free HASL and impedance control within ±10%, we deliver comprehensive turnkey services designed to optimize your supply chain efficiency. Contact us today for a detailed technical consultation.

Multi Layer Board Features
  • High-density rigid PCB capability supporting up to 50 layers for complex circuitry.
  • Advanced impedance control maintained within a strict ±10% tolerance range.
  • Versatile surface finish options including ENIG, lead-free HASL, and OSP.
  • Superior board flatness tolerance of 0.50% for high-reliability assembly.
  • Comprehensive turnkey services covering the entire manufacturing process.
Contact Us 

Multi Layer Board Spec
  • Base Materials: FR-4, Hi-Tg, Halogen-free, Metal core, Ceramic, Teflon, Polyimide.
  • Maximum Board Size: 546.1 x 622.4 mm (21.5" x 24.5").
  • Finished Board Thickness: 0.3 mm to 5.0 mm (0.012" - 0.197").
  • Minimum Finished Hole Size: 0.15 mm.
  • Trace/Space: Inner layer 3.0/3.0 mil; Outer layer 2.5/2.5 mil.
  • Copper Thickness: Inner layer 4/4 oz; Outer layer 5/5 oz.
  • Solder Mask and Legend: Green solder mask with white ink.
Multi Layer Board Application
  • Industrial control systems requiring high-reliability multi-layer structures.
  • Telecommunications equipment utilizing impedance-controlled high-speed circuits.
  • Power electronics benefiting from heavy copper wall plating up to 2 oz.
Customer Challenges & Our Solutions


High failure rates in complex multi-layer boards
We mitigate integration risks by offering high-precision manufacturing up to 50 layers with a 0.50% flatness tolerance. By utilizing premium materials like Hi-Tg and Halogen-free FR-4, we ensure structural integrity and thermal stability, reducing the risk of delamination in demanding environments.
Inconsistent signal integrity in high-speed PCB
Our engineering team provides strict impedance control within ±10% to maintain signal consistency. Combined with our capability for 2.5 mil trace/space and various finishes like ENIG or Immersion Silver, we provide the technical precision necessary for high-frequency applications.
FAQ
What is your capability for minimum hole size and spacing?
We achieve a minimum finished hole size of 0.15 mm and a minimum trace/space of 2.5/2.5 mil for outer layers. This high-density capability allows for more compact designs and complex routing required in modern multi-layer board configurations.


Can you handle non-standard PCB thicknesses and materials?

 Yes, our factory supports finished board thicknesses from 0.3 mm to 5.0 mm. We work with a wide array of base materials including Ceramic, Teflon, Polyimide, and Metal cores to meet specific thermal or mechanical requirements.



Do you offer surface finishes for lead-free requirements?
We provide several lead-free compliant finishes, including lead-free HASL, ENIG, Immersion Silver, and OSP. These options ensure your multi-layer board meets international environmental standards while maintaining excellent solderability and shelf life.


Partnering with a Premium PCB Factory Delivering Multi Layer Board with ENIG Finish allows your procurement team to streamline sourcing through our reliable turnkey services. We specialize in the production of the multi layer board, utilizing advanced materials and a precise solder mask to ensure every PCB factory order meets industrial standards. Our capability to handle up to 50 layers with 5/5 oz outer copper thickness provides a significant cost-to-performance advantage for complex projects. We are committed to delivering high-yield, high-precision components that stabilize your production timeline and reduce long-term maintenance costs. Request a quote today to experience our manufacturing excellence.



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